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| PRELIMINARY V*I Chip Bus Converter Module BCM V*I Chip - BCM Bus Converter Module TM B352F110T24 * 352 V to 11.0 V V*I Chip Converter * 240 Watt (360 Watt for 1 ms) * High density - up to 876 W/in3 * Small footprint - 210 W/in2 * Low weight - 0.5 oz (14 g) * ZVS/ZCS isolated sine amplitude converter * Typical efficiency 95% * 125C operation * <1 s transient response * >2.6 million hours MTBF * No output filtering required (c) Vin = 330 - 365 V Vout = 10.3 - 11.4 V Iout = 21.8 A K = 1/32 Rout = 15.0 m max Actual size Product Description The V*I Chip Bus Converter Module (BCM) is a high efficiency (>95%), narrow input range Sine Amplitude Converter (SAC) operating from a 330 to 365 Vdc primary bus to deliver an isolated low voltage secondary. The off-line BCM provides an isolated 10.3 -11.4 V distribution bus and is ideal for use in silver boxes and PFC front ends. Due to the fast response time and low noise of the BCM, the need for limited life aluminum electrolytic or tantalum capacitors at the input of POL converters is reduced--or eliminated--resulting in savings of board area, materials and total system cost. The BCM achieves a power density of 876 W/in3 in a V*I Chip package compatible with standard pick-andplace and surface mount assembly processes. The V*I Chip package provides flexible thermal management through its low Junction-to-Case and Junction-to-Board thermal resistance. Owing to its high conversion efficiency and safe operating temperature range, the BCM does not require a discrete heat sink in typical applications. Low junction to case and junction to lead thermal impedances assure low junction temperatures and long life in the harshest environments. Absolute Maximum Ratings Parameter +In to -In +In to -In PC to -In +Out to -Out Isolation voltage Output current Peak output current Output power Peak output power Case temperature Operating junction temperature(1) Storage temperature Values -1.0 to 400 500 -0.3 to 7.0 -0.5 to 16.0 4,242 24.1 32.7 240 360 208 -40 to 125 -55 to 125 -40 to 150 -65 to 150 Unit Vdc Vdc Vdc Vdc Vdc A A W W C C C C C Notes For 100 ms Input to Output Continuous For 1 ms Continuous For 1 ms During reflow T - Grade M - Grade T - Grade M - Grade Note: (1) The referenced junction is defined as the semiconductor having the highest temperature. This temperature is monitored by a shutdown comparator. Part Numbering B Bus Converter Module 352 Input Voltage Designator F 110 Output Voltage Designator (=VOUT x10) T 24 Output Power Designator (=POUT/10) Configuration (Figure 15) Product Grade Temperatures (C) Grade Storage Operating T -40 to150 -40 to125 M -65 to150 -55 to125 vicorpower.com 800-735-6200 V*I Chip Bus Converter Module B352F110T24 Rev. 1.1 Page 1 of 13 PRELIMINARY Specifications Input (Conditions are at 352 Vin, full load, and 25C ambient unless otherwise specified) Parameter Input voltage range Input dV/dt Input undervoltage turn-on Input undervoltage turn-off Input overvoltage turn-on Input overvoltage turn-off Input quiescent current Inrush current overshoot Input current Input reflected ripple current No load power dissipation Internal input capacitance Internal input inductance Recommended external input capacitance V*I Chip Bus Converter Module Min 330 Typ 352 Max 365 1 325 Unit Vdc V/s Vdc Vdc Vdc Vdc mA A Adc mA p-p W F nH F Note 275 370 395 1.2 0.2 0.7 610 4.9 0.25 5 2 7.0 PC low Using test circuit in Figure 25; See Figure 1 Using test circuit in Figure 25; See Figure 4 200 nH maximum source inductance; See Figure 25 Input Waveforms Figure 1-- Inrush transient current at full load and 352 Vin with PC enabled Figure 2-- Output voltage turn-on waveform with PC enabled at full load and 352 Vin Figure 3-- Output voltage turn-on waveform with input turn-on at full load and 352 Vin Figure 4-- Input reflected ripple current at full load and 352 Vin vicorpower.com 800-735-6200 V*I Chip Bus Converter Module B352F110T24 Rev. 1.1 Page 2 of 13 PRELIMINARY Specifications (continued) V*I Chip Bus Converter Module Output (Conditions are at 352 Vin, full load, and 25C ambient unless otherwise specified) Parameter Output voltage Output power Rated DC current Peak repetitive power Current share accuracy Efficiency Half load Full load Internal output inductance Internal output capacitance Load capacitance Output overvoltage setpoint Output ripple voltage No external bypass 10 F bypass capacitor Short circuit protection set point Average short circuit current Effective switching frequency Line regulation K Load regulation ROUT Transient response Voltage overshoot Response time Recovery time Output overshoot Input turn-on PC enable Output turn-on delay From application of power From release of PC pin 5 94.5 94.7 95.6 95.8 1.1 31 1,000 11.6 240 14 30.0 3.3 0.0309 0.12 3.5 1/32 11.0 46 200 1 0 0 800 250 3.7 0.0316 15.0 m mV ns s mV mV ms ms 100% load step; See Figures 10 and 11 See Figures 10 and 11 See Figures 10 and 11 No output filter; See Figure 3 No output filter; See Figure 2 No output filter; See Figure 3 No output filter 300 Min 10.3 9.99 0 0 Typ Max 11.4 11.1 240 24.1 360 10 Unit Vdc Vdc W Adc W % % % nH F F Vdc mV p-p mV p-p Adc A MHz Note No load Full load 330 - 365 VIN POUT240 W Max pulse width 1ms, max duty cycle 10%, baseline power 50% See Parallel Operation on page 9 See Figure 5 See Figure 5 Effective value See Figures 7 and 9 See Figure 8 Module will shut down Fixed, 1.75 MHz per phase VOUT = K*VIN at no load Output Waveforms Efficiency vs. Output Power 100 13 Power Dissipation Power Dissipation (W) 12 11 10 9 8 7 6 5 4 3 98 96 Efficiency (%) 94 92 90 88 86 84 82 80 0 24 48 72 96 120 144 168 192 216 240 0 24 48 72 96 120 144 168 192 216 240 Output Power (W) Figure 5-- Efficiency vs. output power at 352 Vin Output Power (W) Figure 6--Power dissipation as a function of output power vicorpower.com 800-735-6200 V*I Chip Bus Converter Module B352F110T24 Rev. 1.1 Page 3 of 13 PRELIMINARY Specifications (continued) V*I Chip Bus Converter Module Figure 7-- Output voltage ripple at full load and 352 Vin; without any external bypass capacitor. Figure 8--Output voltage ripple at full load and 352 Vin with 10 F ceramic external bypass capacitor and 20 nH of distribution inductance. Ripple vs. Output Power 236 216 Output Ripple (mV) 196 176 156 136 116 96 76 56 0 20 40 60 80 100 120 140 160 180 200 220 240 Output Power (W) Figure 9-- Output voltage ripple vs. output power at 352 Vin without any external bypass capacitor. Figure 10-- 0 -21.8 A load step with 2 F input capacitor and no output capacitor. Figure 11-- 21.8- 0 A load step with 2 F input capacitance. vicorpower.com 800-735-6200 V*I Chip Bus Converter Module B352F110T24 Rev. 1.1 Page 4 of 13 PRELIMINARY Specifications General Parameter MTBF MIL-HDBK-217F Isolation specifications Voltage Capacitance Resistance Agency approvals (pending) Mechanical parameters Weight Dimensions Length Width Height (continued) V*I Chip Bus Converter Module Min Typ 2.6 Max Unit Mhrs Vdc pF M Note 25C, GB Input to Output Input to Output Input to Output UL/CSA 60950, EN 60950 Low Voltage Directive See mechanical drawing, Figures 15 4,242 500 10 cTUVus CE Mark 0.50 / 14 1.26 / 32 0.87 / 22 0.25 / 6,2 oz / g in / mm in / mm in / mm Auxiliary Pins (Conditions are at 48 Vin, full load, and 25C ambient unless otherwise specified) Parameter Primary control (PC) DC voltage Module disable voltage Module enable voltage Current limit Enable delay time Disable delay time Min 4.8 2.4 2.4 Typ 5.0 2.5 2.5 2.5 250 20 Max 5.2 2.6 2.9 Unit Vdc Vdc Vdc mA ms s Note Source only See Figure 12, time from PC low to output low Figure 12-- VOUT at full load vs. PC disable Figure 13-- PC signal during fault vicorpower.com 800-735-6200 V*I Chip Bus Converter Module B352F110T24 Rev. 1.1 Page 5 of 13 PRELIMINARY Pin/Control Functions +IN/-IN - DC Voltage Input Ports The V*I Chip input voltage range should not be exceeded. An internal under/over voltage lockout-function prevents operation outside of the normal operating input range. The BCM turns ON within an input voltage window bounded by the "Input under-voltage turn-on" and "Input overvoltage turn-off" levels, as specified. The V*I Chip may be protected against accidental application of a reverse input voltage by the addition of a rectifier in series with the positive input, or a reverse rectifier in shunt with the positive input located on the load side of the input fuse. The connection of the V*I Chip to its power source should be implemented with minimal distribution inductance. If the interconnect inductance exceeds 100 nH, the input should be bypassed with a RC damper to retain low source impedance and stable operation. With an interconnect inductance of 200 nH, the RC damper may be 2 F in series with 0.3. A single electrolytic or equivalent low-Q capacitor may be used in place of the series RC bypass. PC - Primary Control The Primary Control port is a multifunction node that provides the following functions: Enable/Disable - If the PC port is left floating, the BCM output is enabled. Once this port is pulled lower than 2.4 Vdc with respect to -In, the output is disabled. This action can be realized by employing a relay, opto-coupler, or open collector transistor. Refer to Figures 13, 12 and 13 for the typical Enable/Disable characteristics. This port should not be toggled at a rate higher than 1 Hz. The PC port should also not be driven by or pulled up to an external voltage source. Primary Auxiliary Supply - The PC port can source up to 2.4 mA at 5.0 Vdc. The PC port should never be used to sink current. Alarm - The BCM contains circuitry that monitors output overload, input over voltage or under voltage, and internal junction temperatures. In response to an abnormal condition in any of the monitored parameters, the PC port will toggle. Refer to Figure 13 for PC alarm characteristics. TM and RSV - Reserved for factory use. +OUT/-OUT - DC Voltage Output Ports Two sets of contacts are provided for the +Out port. They must be connected in parallel with low interconnect resistance. Similarly, two sets of contacts are provided for the -Out port. They must be connected in parallel with low interconnect resistance. Within the specified operating range, the average output voltage is defined by the Level 1 DC behavioral model of Figure 22. The current source capability of the BCM is rated in the specifications section of this document. The low output impedance of the BCM reduces or eliminates the need for limited life aluminum electrolytic or tantalum capacitors at the input of POL converters. Total load capacitance at the output of the BCM should not exceed the specified maximum. Owing to the wide bandwidth and low output impedance of the BCM, low frequency bypass capacitance and significant energy storage may be more densely and efficiently provided by adding capacitance at the input of the BCM. V*I Chip Bus Converter Module 4 A 3 2 1 A B C D E +Out B C D E +In -Out F G H H J J K K TM RSV PC +Out L M N P L M N P R T -In -Out R T Bottom View Signal Name +In -In TM RSV PC +Out -Out Designation A1-E1, A2-E2 L1-T1, L2-T2 H1, H2 J1, J2 K1, K2 A3-D3, A4-D4, J3-M3, J4-M4 E3-H3, E4-H4, N3-T3, N4-T4 Figure 14--BCM pin configuration vicorpower.com 800-735-6200 V*I Chip Bus Converter Module B352F110T24 Rev. 1.1 Page 6 of 13 PRELIMINARY Mechanical Drawings (continued) V*I Chip Bus Converter Module 22,0 0.87 6,2 0.25 3,01 0.118 15,99 0.630 3,01 0.118 (4) PL. 7,10 0.280 (3) X 1.22 0.48 8,56 0.337 OUTPUT OUTPUT INPUT 32,0 1.26 INPUT 24,00 0.945 16,00 0.630 15,35 0.604 C L 8,00 0.315 C L 12,94 0.509 14,94 0.588 16,94 0.667 22,54 0.887 TOP VIEW (COMPONENT SIDE) BOTTOM VIEW NOTES: 1- DIMENSIONS ARE mm/[INCH]. 2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE: .X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005] 3- PRODUCT MARKING ON TOP SURFACE. Figure 15-- BCM J-Lead mechanical outline; Onboard mounting 3,26 0.128 1,38 0.054 TYP 15,74 0.620 3,26 0.128 0,51 TYP 0.020 (2) X 8,94 0.352 (6) X 1,60 0.063 +OUT +IN -OUT1 7,48 (8) X 0.295 22,54 (2) X 0.887 (2) X16,94 0.667 (2) X14,94 0.588 12,94 (2) X 0.509 11,48 (2) X 0.452 TM RSV PC +OUT2 (2) X 16,00 0.630 -OUT2 8,00 (2) X 0.315 (2) X 24,00 0.945 -IN RECOMMENDED LAND PATTERN (COMPONENT SIDE SHOWN) NOTES: 1- DIMENSIONS ARE mm/[INCH]. 2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE: .X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005] Figure 16-- BCM PCB land layout information vicorpower.com 800-735-6200 V*I Chip Bus Converter Module B352F110T24 Rev. 1.1 Page 7 of 13 PRELIMINARY Configuration Options Standard(1) (Figure 17) 876 W/in3 2.4 C/W 1.1 C/W 6.8 C/W V*I Chip Voltage Transformation Module CONFIGURATION Effective power Density Junction-board Thermal Resistance Junction-Case Thermal Resistance Junction-Ambient Thermal Resistance 300LFM Notes: (1) Surface mounted to a 2" x 2" FR4 board, 4 layers 2 oz Cu Standard with 0.25" heatsink 440 W/in3 2.4 C/W N/A 5.0 C/W 22.0 0.87 32.0 1.26 6.3 0.25 STANDARD MOUNT Figure 17--Onboard mounting - package F Figure 18--Hole location for push pin heatsink relative to VIC Thermal Symbol Parameter Over temperature shutdown Thermal capacity Junction-to-case thermal impedance Junction-to-board thermal impedance Junction-to-ambient (1) Junction-to-ambient (2) Min 125 Typ 130 0.61 1.1 2.1 6.5 5.0 Max 135 Unit C Ws/C C/W C/W C/W C/W Note Junction temperature RJC RJB RJA RJA Notes: (1) B352F110T24 surface mounted to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM. (2) B352F110T24 with a 0.25"H Heatsink surface mounted on FR4 board, 300 LFM. vicorpower.com 800-735-6200 V*I Chip Bus Converter Module B352F110T24 Rev. 1.1 Page 8 of 13 PRELIMINARY Application Note Parallel Operation The BCM will inherently current share when operated in an array. Arrays may be used for higher power or redundancy in an application. Current sharing accuracy is maximized when the source and load impedance presented to each BCM within an array are equal. The recommended method to achieve matched impedances is to dedicate common copper planes within the PCB to deliver and return the current to the array, rather than rely upon traces of varying lengths. In typical applications the current being delivered to the load is larger than that sourced from the input, allowing traces to be utilized on the input side if necessary. The use of dedicated power planes is, however, preferable. The BCM power train and control architecture allow bi-directional power transfer, including reverse power processing from the BCM output to its input. Reverse power transfer is enabled if the BCM input is within its operating range and the BCM is otherwise enabled. The BCM's ability to process power in reverse improves the BCM transient response to an output load dump. Thermal Management The high efficiency of the V*I Chip results in relatively low power dissipation and correspondingly low generation of heat. The heat generated within internal semiconductor junctions is coupled with low effective thermal resistances, RJC and RJB, to the V*I Chip case and the PCB allowing thermal management flexibility to adapt to specific application requirements (Figure 19). CASE 1 Convection via heatsink to air. The total Junction-to-Ambient thermal resistance, RJA, of a surface mounted V*I Chip with a 0.25"heatsink is 5C/W in 300 LFM air flow (Figure 21). At full rated output power of 240 W, the heat generated by the BCM is approximately 11 W (Figure 6). Therefore, the junction temperature rise to ambient is approximately 53C. Given a maximum junction temperature of 125C, a temperature rise of 53C allows the V*I Chip to operate at rated output power at up to 72C ambient temperature. At 100 W of output power, operating ambient temperature extends to 103C. Output Power (W) V*I Chip Bus Converter Module CASE 2--Conduction to the PCB The low thermal resistance Junction-to-board, RJB, allows use of the PCB to exchange heat from the V*I Chip, including convection from the PCB to the ambient or conduction to a cold plate. For example, with a V*I Chip surface mounted on a 2" x 2" area of a multi-layer PCB, with an aggregate 8 oz of effective copper weight, the total Junction-to-Ambient thermal resistance, RJA, is 6.5C/W in 300 LFM air flow (see Thermal section, page 8). Given a maximum junction temperature of 125C and 11 W dissipation at 240 W of output power, a temperature rise of 72C allows the V*I Chip to operate at rated output power at up to 53C ambient temperature. 240 0 -40 -20 0 20 40 60 80 100 120 140 Operating Junction Temperature (C) Figure 20-- Thermal derating curve BCM with 0.25'' Heatsink 10 9 8 Tja JC = 1.1C/W JB = 2.1C/W 7 6 5 4 3 0 100 200 300 400 500 600 Airflow (LFM) Figure 19--Thermal resistance Figure 21--Junction-to-ambient thermal resistance of BCM with 0.25" Heatsink vicorpower.com 800-735-6200 V*I Chip Bus Converter Module B352F110T24 Rev. 1.1 Page 9 of 13 PRELIMINARY Application Note (continued) The thermal resistance of the PCB to the surrounding environment in proximity to V*I Chips may be reduced by low profile heat sinks surface mounted to the PCB.The PCB may also be coupled to a cold plate by low thermal resistance standoff elements as a means of achieving effective cooling for an array of V*I Chips, without a direct interface to their case. CASE 3--Combined direct convection to the air and conduction to the PCB. Parallel use of the V*I Chip internal thermal resistances (including Junctionto-Case and Junction-to-board) in series with external thermal resistances provides an efficient thermal management strategy as it reduces total thermal resistance. This may be readily estimated as the parallel network of two pairs of series configured resistors. V*I Chip Bus Converter Module V*I Chip Bus Converter Level 1 DC Behavioral Model for 352 V to 11.0 V, 240 W IOUT ROUT 11.0 m + 1/32 * Iout + V*I 1/32 * Vin VIN IQ 14 mA + - K + VOUT - - (c) - Figure 22--This model characterizes the DC operation of the V*I Chip bus converter, including the converter transfer function and its losses. The model enables estimates or simulations of output voltage as a function of input voltage and output load, as well as total converter power dissipation or heat generation. V*I Chip Bus Converter Level 2 Transient Behavioral Model for 352 V to 11.0 V, 240 W 0.22 nH LIN = 5 nH IOUT ROUT 11.0 m Lout = 1.1 nH + RCIN 32 m 1/32 * Iout V*I 1.1 m RCOUT 0.2 m + CIN VIN 0.25F IQ 14 mA + - K + - 1/32 * Vin COUT 31 F VOUT - - (c) Figure 23--This model characterizes the AC operation of the V*I Chip bus converter including response to output load or input voltage transients or steady state modulations. The model enables estimates or simulations of input and output voltages under transient conditions, including response to a stepped load with or without external filtering elements. vicorpower.com 800-735-6200 V*I Chip Bus Converter Module B352F110T24 Rev. 1.1 Page 10 of 13 PRELIMINARY Application Note (continued) Input Impedance Recommendations To take full advantage of the BCM capabilities, the impedance presented to its input terminals must be low from DC to approximately 5 MHz. The source should exhibit low inductance (less than 100 nH) and should have a critically damped response. If the interconnect inductance exceeds 100 nH, the BCM input pins should be bypassed with an RC damper (e.g., 2 F in series with 0.3 ohm) to retain low source impedance and stable operations. Given the wide bandwidth of the BCM, the source response is generally the limiting factor in the overall system response. Anomalies in the response of the source will appear at the output of the BCM multiplied by its K factor. The DC resistance of the source should be kept as low as possible to minimize voltage deviations. This is especially important if the BCM is operated near low or high line as the over/under voltage detection circuitry could be activated. Input Fuse Recommendations V*I Chips are not internally fused in order to provide flexibility in configuring power systems. However, input line fusing of V*I Chips must always be incorporated within the power system. A fast acting fuse should be placed in series with the +IN port. V*I Chip Bus Converter Module Applying the BCM BCM Vin = 330-365 Vdc NP NS K=NS / NP BCM NP NS Vout = (Vin*K) - (Iout*Rout) = 10.3-11.4 Vdc @ No load = 9.99-11.1 Vdc @ Full load K=NS / NP BCM NP NS B352F110T24 K = 1/32 Iout = 21.8 A @ 11.0 V Rout = 11.0 m K=NS / NP Isolation Barrier Standoff Voltage = 4,242 Vdc Paralleling BCMs automatically current share when connected in parallel. No interconnections required. Figure 24--The BCM provides an isolated output proportional to its input. It is easily parallelable to create high power arrays and/or for N+M redundancy. Input reflected ripple measurement point F1 1A Fuse +In Enable/Disable Switch +Out + R3 0.1 m C3 10 F C1 2 F electrolytic SW1 R2 2 k TM RSV PC BCM K Ro -Out Load D1 -In +Out -Out - Notes: Source inductance should be no more than 200 nH. If source inductance is greater than 200 nH, additional bypass capacitance may be required. C3 should be placed close to the load. R3 may be ESR of C3 or a separate damping resistor. D1 power good indicator will dim when a module fault is detected. Figure 25--BCM test circuit vicorpower.com 800-735-6200 V*I Chip Bus Converter Module B352F110T24 Rev. 1.1 Page 11 of 13 PRELIMINARY V*I Chip Bus Converter Module V*I Chip soldering recommendations V*I Chip modules are intended for reflow soldering processes. The following information defines the processing conditions required for successful attachment of a V*I Chip to a PCB. Failure to follow the recommendations provided can result in aesthetic or functional failure of the module. Storage V*I Chip modules are currently rated at MSL 5. Exposure to ambient conditions for more than 48 hours requires a 24 hour bake at 125C to remove moisture from the package. Solder paste stencil design Solder paste is recommended for a number of reasons, including overcoming minor solder sphere co-planarity issues as well as simpler integration into overall SMD process. 63/37 SnPb, either no-clean or water-washable, solder paste should be used. Pb-free development is underway. The recommended stencil thickness is 6 mils. The apertures should be 0.9-0.9:1. Pick and place Modules should be placed within 5 mils.to maintain placement position, the modules should not be subjected to acceleration greater than 500 in/sec2 prior to reflow. Reflow There are two temperatures critical to the reflow process; the solder joint temperature and the module's case temperature. The solder joint's temperature should reach at least 220C, with a time above liquidus (183C) of ~30 seconds. The module's case temperature must not exceed 208 C at anytime during reflow. Because of the T needed between the pin and the case, a forced-air convection oven is preferred for reflow soldering. This reflow method generally transfers heat from the PCB to the solder joint. The module's large mass also reduces its temperature rise. Care should be taken to prevent smaller devices from excessive temperatures. Reflow of modules onto a PCB using Air-Vac-type equipment is not recommended due to the high temperature the module will experience. Inspection The solder joints should conform to IPC 12.2 * Properly wetted fillet must be evident. * Heel fillet height must exceed lead thickness plus solder thickness. Figure 27-- Properly reflowed V*I Chip J-Lead 16 Soldering Time Removal and rework V*I Chip modules can be removed from PCBs using special tools such as those made by Air-Vac. These tools heat a very localized region of the board with a hot gas while applying a tensile force to the component (using vacuum). Prior to component heating and removal, the entire board should be heated to 80-100C to decrease the component heating time as well as local PCB warping. If there are adjacent moisture-sensitive components, a 125C bake should be used prior to component removal to prevent popcorning. V*I Chip modules should not be expected to survive a removal operation. 239 Joint Temperature, 220C Case Temperature, 208C 183 165 degC 91 Figure 26--Thermal profile diagram vicorpower.com 800-735-6200 V*I Chip Bus Converter Module B352F110T24 Rev. 1.1 Page 12 of 13 Warranty Vicor products are guaranteed for two years from date of shipment against defects in material or workmanship when in normal use and service. This warranty does not extend to products subjected to misuse, accident, or improper application or maintenance. Vicor shall not be liable for collateral or consequential damage. This warranty is extended to the original purchaser only. EXCEPT FOR THE FOREGOING EXPRESS WARRANTY, VICOR MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Vicor will repair or replace defective products in accordance with its own best judgement. For service under this warranty, the buyer must contact Vicor to obtain a Return Material Authorization (RMA) number and shipping instructions. Products returned without prior authorization will be returned to the buyer. The buyer will pay all charges incurred in returning the product to the factory. Vicor will pay all reshipment charges if the product was defective within the terms of this warranty. Information published by Vicor has been carefully checked and is believed to be accurate; however, no responsibility is assumed for inaccuracies. Vicor reserves the right to make changes to any products without further notice to improve reliability, function, or design. Vicor does not assume any liability arising out of the application or use of any product or circuit; neither does it convey any license under its patent rights nor the rights of others. Vicor general policy does not recommend the use of its components in life support applications wherein a failure or malfunction may directly threaten life or injury. Per Vicor Terms and Conditions of Sale, the user of Vicor components in life support applications assumes all risks of such use and indemnifies Vicor against all damages. Vicor's comprehensive line of power solutions includes high density AC-DC and DC-DC modules and accessory components, fully configurable AC-DC and DC-DC power supplies, and complete custom power systems. Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for its use. Vicor components are not designed to be used in applications, such as life support systems, wherein a failure or malfunction could result in injury or death. All sales are subject to Vicor's Terms and Conditions of Sale, which are available upon request. Specifications are subject to change without notice. Intellectual Property Notice Vicor and its subsidiaries own Intellectual Property (including issued U.S. and Foreign Patents and pending patent applications) relating to the products described in this data sheet. Interested parties should contact Vicor's Intellectual Property Department. Vicor Corporation 25 Frontage Road Andover, MA, USA 01810 Tel: 800-735-6200 Fax: 978-475-6715 email Vicor Express: vicorexp@vicr.com Technical Support: apps@vicr.com vicorpower.com 800-735-6200 V*I Chip Bus Converter Module B352F110T24 Rev. 1.1 11/05 |
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